Engineering publications brought to you by Mark Allen

Memory

DRAM market sees record revenues in 2Q18

Green Hills and Paragon Software to deliver safe and secure IVI system

Toshiba Memory Europe announces 96-layer BiCS FLASH development

Micron and Intel announce update to 3D XPoint joint development program

Extending interconnects beyond the 3nm technology node

Microchip’s 8-bit tinyAVR MCUs enable increased functionality in sensor nodes

Fujitsu announces FRAM with a capacity of 8Mbit

Samsung launches NVMe SSD based on next generation small form factor

Long-term DDR3 memory module supply chain solution

Toshiba Memory Europe introduces XS700 series of portable SSDs

Samsung starts mass production of 10nm-class 32GB DDR4 SoDIMMs

“World’s most advanced” flash memory solutions for developers of safety-critical applications in automotive and industrial