Engineering publications brought to you by Mark Allen

Electronics

Imec and TNO launch Holst Centre Photonics Lab

Infineon’s PSOC 4100T Plus MCU offers advanced sensing capabilities and system control

Finwave Semiconductor announces successful $8.2m funding round

MediaTek’s Dimensity 9400e mobile platform provides enhanced AI and connectivity

Rambus makes chipsets available for next-generation AI PC memory modules

Microsoft laying off 7,000 workers despite profitable quarters

The ‘Shift Left’ evolution in analogue mixed signal design

CELUS leverages next generation of AI intelligence to simplify design process

xMEMS unveils thinnest speaker to date, engineered for wearables

Siemens deploys AI in new Questa One smart verification solution

Samsung said to be near to securing 2nm orders

POLYN Technology announces first tapeout of NASP chip