Engineering publications brought to you by Mark Allen

PCAP Touch Solutions for a large range of Temperatures

Leti develops acousto-microfluidic technology

Molex releases Wire-to-Board Connector System

Companies bring real-time VR/AR collaboration to immersive shared VR environments

Embedded Live Conference line up announced featuring Hitex, Arm and NXP

Heilind stocking Harting’s Han-Eco B series

Innovative data-over-sound connectivity

DVCon Europe announces Keynotes for 2019

Survey reveal disquiet over facial recognition technology

iPhone XR out-ships the Galaxy A10

Nexperia secures $1.5bn financing to fund future growth plans

Rugged wide-range input 6/10W power modules for industrial and ITE applications