Engineering publications brought to you by Mark Allen

Semiconductor verification solution embedded with ML capabilities

Avnet launches COM Express modules based on Tiger Lake UP3

High-reliability, extended-temperature Ethernet PHY transceiver

RS Components stocking SiC MOSFETs from ON

Cadence collaborating with GLOBALFOUNDRIES on 12LP/12LP+ solutions

Eliminating latency in next generation Wi-Fi 6E devices

Melexis unveils general purpose Hall-effect latch for cost-sensitive applications

CEVA and VisiSonics bring 3D spatial audio to the consumer space

Xilinx and Continental collaborate on first production-ready auto 4D imaging radar

Ensemble Graphics Toolkit to speed Linux GUI development

Supermicro is first-to-market with NEBS Level 3 Certified 1U server

Congatec unveils 'state-of-the-art' Computer-on-Modules