Engineering publications brought to you by Mark Allen

650V Silicon Carbide Schottky Diodes

Rear panel mount options for Harwin's hi-rel cable connector products

OMC delivers flexible fibre optic housing

Teledyne expands technical support for its ADC series

Chipset specific IPDs can help to simplify development of IoT applications

Porotech raises £3m for new generation of microdisplays

Neurala raises $12m to scale AI for industrial manufacturing

Ceva unveils ultra-wideband platform IP

Cadence and Presto Engineering collaborate on IC packaging

Melexis unveils automotive 200-2000A current sensors

STMicroelectronics extends STM32G0 MCU series

Tower joins ST's Agrate R3 300mm fab