Engineering publications brought to you by Mark Allen

Introducing LEMO's new REDEL 2P High Voltage Connectors

Alchip opens 3DIC ASIC design services

SkyWater launches ThermaView to support thermal imaging designers

Microchip making samples of the Switchtec PCIe Gen 4.0 available

Farnell adds microBRICK regulator from Vishay to line card

Dissecting the EU’s ESPR and delivering business success

US imposes new export restrictions on AI chips

SiTime precision timing enables more efficient AI datacentres

Quantum Science receives Innovate UK funding for high-speed SWIR cameras

NXP secures €1bn loan to advance semiconductor innovation in Europe

HighTec C/C++ Compiler suite supports Nuclei System Technology’s RISC-V IP

u-blox unveils RUBY-W2, its first automotive grade Wi-Fi 7 module