Furthermore, across the design of all types of electronic devices, recurring themes include considering material properties, maintaining proper current levels and avoiding thermal fatigue. The use of numerical simulation to achieve these design goals is increasing with device performance and competition.
The simulation projects presented in this application note span diverse systems that employ electrical currents.
In these cases and in most engineering applications, the concurrent investigations of heat transfer mechanisms and factors in a system that cause temperature variations lead to a better understanding of the impact of design changes on a products performance.
In this application note, the capabilities and features of the COMSOL Multiphysics software and its add-on products for analysing heat transfer and multiphysics behaviour in devices are described as they are used across the case studies under consideration. The use of physics interfaces, couplings and postprocessing functionality to study phenomena such as convective cooling, Joule heating, phase change and thermal expansion is discussed.
In addition to physics modelling capabilities, the ability to turn multiphysics models into simulation applications, allowing for greater access to numerical simulation, is also highlighted. Simulation applications enable simulation specialists to deploy their simulation results to collaborators or customers without compromising their intellectual property or requiring the recipient to be familiar with the COMSOL software.
The examples found within this application note are for illustrative purposes only. The capabilities of COMSOL Multiphysics are applicable to a seemingly infinite number of applications and design needs and allow any number of physics couplings and behaviour types to be studied.