TI Hi-Z buffer amplifier increases signal bandwidth tenfold

Texas Instruments (TI) has introduced a high-input-impedance (Hi-Z) buffer amplifier, capable of supporting frequency bandwidths as high as 3 GHz.

The wider bandwidth and high slew rates of the BUF802 enable higher signal throughput and minimal input settling time. Designers will be able to leverage this faster throughput to measure higher-frequency signals more accurately in test and measurement applications including oscilloscopes, active probes and high-frequency data-acquisition systems.

The bandwidth achieved by the BUF802 was previously only possible by using application-specific integrated circuits (ASICs) that can increase system design time, complexity and cost. By eliminating ASICs, designers who use TI’s buffer can get to market faster achieving a wide dynamic range but at a significantly lower cost.

The BUF802 provides a single-chip alternative to ASICs or FET-input amplifier-based implementations by integrating the features of discrete components while providing 10 times wider bandwidth than FET-input amplifiers, matching the performance of custom ASICs.

It is the industry’s first buffer to enable quiescent current adjustment for a range of bandwidth and signal swing requirements, from 100 MHz to 3 GHz at 1-V peak to peak (VPP) and as high as 2 GHz at 2 VPP. This wide adjustment range for bandwidth and signal swing allows designers to easily scale their front-end designs across multiple data-acquisition applications, easing system cost and redesign.

Integrated functional modes allow engineers to use the BUF802 as a standalone buffer or in a composite loop with a precision amplifier like the OPA140.

As a stand-alone buffer, the BUF802 can help achieve high input impedance and high slew rates in applications that can tolerate 100-mV offsets or where the signal chain is AC-coupled.

In a composite loop, the new buffer can achieve high DC precision and 3-GHz bandwidth in applications requiring 1 μV/°C maximum offset drift.