The Planar X Series is part of an initiative that looks to create cutting-edge board-level ceramic-based thick film RF filters, designed and tested to support various applications markets.
The small footprint, light weight and surface mountable configuration allow for high-volume pick and place applications and make Planar X Series suitable for SATCOM, radar and broadcasting industries.
With the Planar X Series, Smiths Interconnect has leveraged existing thick film process technology upon various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution offering:
- Compact size and light weight, resulting in reduced overall system mass in critical space applications
- Excellent rejection characteristics, providing best in-class RF performance
- Robust materials, suitable for harsh environment
- Integration capabilities
