Infineon expands Prime Switch family

Infineon Technologies has expanded its high-power Prime Switch family with the new Press Pack IGBT (PPI) with internal freewheeling diodes (FWD) in Ceramic Disc Housings.

This PPI has been specifically designed for transmission and distribution applications and is intended for high current Modular Multilevel Converter (MMC), medium voltage drives, DC breakers, wind turbine converters and traction systems.

The Prime Switch IGBT features a blocking voltage of 4.5 kV at 3000 A without FWD and 2000 A with FWD. Fitting to the 3000 A PPI, Infineon offers external freewheeling diodes in four different silicon diameters: D1600U45X122, D2700U45X122, D3900U45X172 and D4600U45X172.

The high-voltage IGBT chip trench technology combined with high-reliable press-pack technology provides customers with a high-performance solution for ultra-high-power applications. In addition, the devices will help to deliver new opportunities to optimise high-power applications in terms of losses, reliability and cost.

The PPI-housing is hermetically sealed and specifically designed to withstand system-induced failures. In this way, the PPI provides an extremely robust break resistance of the housing in addition to a “short-on-fail” feature.

In order to cover numerous applications and power ranges, the design of internal chip-stack and housing enables Infineon to create a fitting portfolio that offers different current values and topologies.