congatec expands modular edge server ecosystem

2 mins read

congatec has expanded its ecosystem for modular edge servers with new products that include a server carrier board in the µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake).

The µATX server board for COM-HPC modules was developed for compact real-time servers that are used in edge applications and critical infrastructures. The board can be flexibly scaled with the latest high-end COM-HPC Server modules from congatec.

Together with the updated modules, which are equipped with the latest Intel Xeon D-1800 and D-2800 processors, customers receive a ready-to-use µATX platform for applications with high performance requirements in a space-saving design.

The ecosystem of COM-HPC modules and µATX carrier board offers OEMs a wide range of customisation options at module, board and system level from which developers can choose according to their needs.

These products have been tailored to the stringent requirements of edge computing and offer powerful, reliable and ready-to-use building blocks for industrial environments. The modular approach shortens the time to market for new designs and helps to future-proof them.

The µATX carrier board conga-HPC/uATX server offers maximum I/O and expansion options in a compact standard form factor making them suitable for numerous applications, such as consolidating servers for virtual machines (VM) or edge servers for energy microgrids, video processing, facial recognition, security applications, and smart city infrastructures.

The conga-HPC/uATX server offers multiple features to drive such applications, including robust communication options with up to 100 GbE and bandwidth, x8 and x16 PCIe expansion for processing AI-intensive workloads via GPGPUs or other compute accelerators, 2x M.2 Key M slots for NVMe SSDs and a M.2 Key B slot for compact AI accelerators or communication modules for WiFi or LTE/5G.

The conga-HPC/sILL and conga-HPC/sILH Server-on-Modules take advantage of the latest Intel Ice Lake D-1800 LCC and D-2800 HCC processor series, which offers up to 15% more performance at the same TDP compared to the previous D-1700/D-2700 series 8.

The improved performance per watt of the COM-HPC modules is intended for high-performance applications that were previously limited by their thermal budget. They also benefit from Intel Speed Select technology, which makes it easier to balance the computing performance and maximum TDP of the system design.

The latest processors have up to 22 cores with higher clock speeds to support next-generation edge applications with more performance per watt for more energy-efficient and therefore more reliable designs.

The COM-HPC server modules’ firmware-integrated hypervisor makes the evaluation of consolidating servers with virtual machines simpler. Also with full real-time capability, which is provided by TCC, TCN and optional SyncE support these modules are suitable for all networked 5G solutions that require very low latencies and strict frequency/clock synchronization.

For the new COM-HPC Server-on-Modules based µATX solution platform, congatec also offers various comprehensive cooling solutions, including passive cooling for small chassis.

In addition to customising the conga-HPC/uATX server carrier board, the service package also includes customer-specific BIOS/UEFI and real-time hypervisor implementations as well as expansion with additional IIoT functionalities for digitization purposes.