The evaluation board features a pin header in an Arduino UNO footprint. This is configurable as a shield or board and a mikroBUS socket ensures easy compatibility with external components like sensors and displays for quick prototyping.
It also comes with an additional 64Mbit memory on board and a board configuration which is available within Zephyr/nRF Connect SDK.
All the different module interfaces like GPIOs (all 32), NFC-A, current measurement pins, and Segger J-Link on-board debugger are available, which makes the evaluation board suited for the evaluation of the PAN B511-1C module and rapid prototyping of lighting applications, home appliances, industrial sensors, medical devices, healthcare wearables, energy management devices and solar farms.
This small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features enhanced performance and improved memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad, with the module providing access to all 32 GPIOs of the chip. With its hybrid packaging design of castellated holes and LGA, the module remains small.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC.
Samples are already available now and the start of mass production is scheduled for June 2025.
