BLE modules and software provide IoT developers design flexibility and cost savings

Microchip Technology has announced its next-generation Bluetooth Low Energy (BLE) solutions. Qualified to the latest Bluetooth 4.2 standard, the IS1870 and IS1871 Bluetooth LE RF ICs, along with the BM70 module, expand Microchip’s existing Bluetooth portfolio and carry both worldwide regulatory and Bluetooth Special Interest Group (SIG) certifications.

Microchip’s BLE devices include an integrated, certified Bluetooth 4.2 firmware stack.Microchip claims that developers can expect up to 2.5 times faster data transfer speeds and greater connection security, with government-grade (FIPS-based) secure connection support.Data is sent and received over the Bluetooth link using Transparent UART mode, allowing integration with any processor or Microchip PIC MCUs that have a UART interface.The module also supports standalone ‘hostless’ operation for beacon applications.

The optimised power profile of these devices minimises current consumption for extended battery life, in compact form factors as small as 4 x 4mm for the RF ICs and 15 x 12mm for the module.

Developers can leverage Microchip’s Bluetooth Qualified Design ID (QDID) to list their products with the Bluetooth SIG.Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP and L2CAP, as well as proprietary services for Transparent UART.