Xilinx is working with TSMC on the development of products based on the latter's 7nm process technology. It says it expects these devices to be introduced some time in 2017.

"TSMC has been the foundation of our success at 28nm, 20nm and 16nm – what we call our 3Peat," said Moshe Gavrielov, Xilinx' president and CEO. "Its outstanding process technology, 3D stacking technology, and foundry services have enabled Xilinx to build an unparalleled reputation for product excellence, quality, execution and market leadership. We believe TSMC's 7nm technology will be even more transformative for Xilinx."

This will be the fourth consecutive generation where the two companies have worked together on advanced process and CoWoS 3D stacking technology.

"TSMC is pleased to work with Xilinx to enable its fourth generation of breakthrough products," said Mark Liu, president and co-CEO of TSMC. "Our collaboration will bring about a new generation of scaling and 3D integration advantages, built on a proven track record of collaboration and execution by both companies."