Globalfoundries unveils 7nm FinFET process

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Following its announcement in September 2016 that it was developing a 7nm FinFET process, Globalfoundries says development is on track and the first products featuring the technology are expected to launch in the first half of 2018. The process – called 7LP – is said to bring a 40% performance boost over its 14nm technology.

“Our 7nm FinFET technology development is on track and we are seeing strong customer traction, with multiple product tapeouts planned in 2018,” said Gregg Bartlett, pictured, senior vice president of GF’s CMOS business unit. “And, while driving to commercialise 7nm, we are actively developing next-generation technologies at 5nm and beyond to ensure our customers have access to a world-class roadmap at the leading edge.”

To accelerate the 7LP production ramp, GF is investing in new process equipment capabilities, including the addition of the first two EUV lithography tools in the second half of this year. The initial production ramp of 7LP will be based on optical lithography, with migration to EUV when the technology is ready for volume manufacturing.

Meanwhile, GF has also announced FX-7, an ASIC platform based in its 7nm FinFET process technology. FX-7 offers a suite of interface IP, memory solutions, ARM processors and packaging options.