Toshiba developing 19nm nand chips up to 128GB
Toshiba is to apply its second generation 19nm process technology to a new family of embedded flash memory modules.
Available in densities from 4 to 128GB, the devices come with a dedicated controller and fit in an ultra small 11.5 x 13 x 1.0mm package.
Mass production is scheduled for the end of November. Target applications include digital consumer products, such as smartphones, tablets and video cameras.
The first device to come out of the range will be a 32GB embedded module which integrates 64Gbit (equal to 8GB) nand chips.
The module is compliant with JEDEC e?MMCTM Version 5.0, published by JEDEC in September, and is optimised to achieve a high read/write performance by applying the new HS400 high speed interface standard.
