SolidRun unveils module for next-generation networking and edge solutions

2 mins read

SolidRun, a developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, has launched the Ryzen V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor.

Based on AMD’s 6nm ‘Zen3’ architecture, this is an ultra-powerful embedded solution that offers improved performance and power efficiency.

As SolidRun’s first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module provides more efficient, high-performance computing for a diverse range of networking and edge applications.

“Our new Ryzen V3000 CX7 Com module is an exciting addition to our CX7 product line as it represents a significant leap forward in embedded computing and offers improved performance and scalability for networking and edge applications,” said Dr. Atai Ziv, CEO at SolidRun. “By leveraging the power of AMD’s Ryzen Embedded V3000 processor, we are empowering developers to create innovative solutions that meet the evolving demands of modern embedded computing.”

Based on the AMD Ryzen Embedded V3000 processor, the module brings improved processing power, thermal efficiency, and high-speed I/O connectivity to the COM Express Type 7 form factor.

With the integration of AMD’s ‘Zen 3’ CPU x86 core architecture, this embedded module delivers, according to SolidRun, exceptional CPU performance, scalability, and reliability, which makes it suitable for a wide range of storage, networking, and edge systems.

In addition to its powerful processing capabilities, the Ryzen V3000 CX7 Com module offers a comprehensive suite of integrated I/O interfaces, making it a versatile solution for a wide range of applications.

With support for up to 20 lanes of PCIe Gen4, developers can leverage high-speed data transfer for networking, storage, and acceleration purposes. The inclusion of dual 10Gb Ethernet MAC also provides enhanced connectivity for networking applications, ensuring reliable and high-bandwidth data transmission.

In addition, the module supports up to 96GB of dual-channel 64-bit DDR5 memory (ECC/non-ECC), enabling efficient memory utilisation and enhanced data integrity.

These integrated features make the module suitable for demanding networking, edge computing, and storage applications, where high-performance, reliability, and scalability are paramount.

“AMD Ryzen Embedded V3000 processors meet the processing requirements of a wide range of embedded applications, including storage, cloud, enterprise, networking, security, and edge,” said Sasha Strizhiver, embedded product line manager at SolidRun. “With features such as extensive RAS coverage, enterprise-class reliability, and up to 10-year planned product availability, our new Ryzen V3000 CX7 SOM offers a compelling solution for industrial customers with demanding workloads.”

The COM Express module is being offered in both commercial and industrial grade applications, can be run with or without a fan, and supports a broad temperature range from as low as -40°C up to as high as +85°C, ensuring its suitability for deployment in even harsh environmental conditions.

Key Features of the Ryzen V3000 CX7 Com Module include:

  • 8 ‘Zen 3’ x86 CPU cores for robust processing capabilities
  • 20 lanes of PCIe Gen4 for high-speed data transfer
  • Dual 10Gb Ethernet MAC for best-in-class connectivity
  • DDR5 memory support with speeds up to 4800 MT/s for enhanced performance
  • Power efficiency with a TDP range of 10-54 Watts
  • Compact COM Express Type 7 form factor

The Ryzen V3000 CX7 Com is now available and to speed up the development process, customers will have access to a software support package and SolidRun’s support tools.