The SHIP-RF programme is a US Department of Defense (DoD) sponsored initiative that is aimed at advancing leading-edge microelectronics design and manufacturing capabilities in the United States. As part of the programme, Cadence is to provide services, tools and Assembly Design Kits (ADKs) to enable Qorvo and their customers to achieve first-pass design and manufacturing success for next-generation RF and mixed-signal systems that are delivered as both packages and modules.
Cadence will develop methodologies and flows to implement design and simulation capabilities for 2.5D and 3D heterogeneous integration. These will include advanced technologies such as Allegro Pulse, Clarity 3D Solver, Celsius Thermal Solver, and the Allegro X Design Platform.
Incorporating Cadence ADK solutions with Qorvo’s foundry PDKs and their SHIP-RF Assembly and Test Center (ATC) manufacturing rules will enable the complete modelling and product simulation for mission-critical aerospace and defence applications.
“Cadence is the only EDA company accredited by the DoD as a Trusted Supplier. We will provide Qorvo and our customers with capabilities to rapidly and accurately design sophisticated packages and modules that will be fabricated and tested in the Qorvo manufacturing facility, resulting in reduced development time, iterations and cost,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group, Cadence.
Commenting Roger Hall, general manager of Qorvo’s High Power Solutions (HPS) business added, “Cadence’s offerings can increase design productivity to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.”