Unveiled by JDC earlier this year at CES in Las Vegas, the eSP70 silicon backplane is tailored for the needs of microLED devices. The full colour capable active matrix backplane features a resolution of 1920x1080, a pixel pitch of 8µm and offers current uniformity via a proprietary current source pixel as well as flexible addressing.
Making displays brighter for portable AR and VR battery-powered devices, for example, is increasingly challenging. Using existing technologies which require high power output is a serious design limitation as the compact devices have limited space to house on-board power sources. By utilising JDC’s eSP70 backplane, Plessey will have greater flexibility to use its GaN-on-Si platform for microLEDs, providing very high brightness with moderate power consumption or run with low power while maintaining daylight usable brightness levels.
Commenting JDC’s VP Marketing and Product Management, T.I. Lin, said: “Plessey’s monolithic microLED array is a great match to JDC’s high-density silicon backplane. Our JD27E series demonstrates our ability to deliver silicon that has been designed with microLED needs in mind. Our X-on-Silicon backplane technology for microLED can be customised on a per-project basis, allowing us to make specialised silicon suiting needs ranging from low-power AR headsets all the way to automotive headlights.”
According to Dr Keith Strickland, Chief Technology Officer at Plessey, “JDC’s microLED specific silicon backplane allows Plessey to rapidly bring to market our monolithic full colour microLED array at our entry level 8µm pixel size.”
MicroLED technology is emerging as a technology that’s able to provide high luminance in a very small form factor with minimal energy consumption, reducing costs and enabling lightweight battery-powered AR/ VR/ MR/ HUD applications.