Developed using the company's proprietary high-speed laser writing technique, OptoCplrLT has been designed to overcome fibre-to-SiPh photonic integrated circuit (PIC) coupling challenges in order to enable high volume automated assembly and drive down costs.
OptoCplrLT uses low-loss light turning curved mirrors, which are formed in the glass, to direct the light to or from the SiPh grating couplers. This prevents the need for bend-tolerant fibre solutions, which are often expensive, challenging to manufacture and have some significant limitations in terms of both size and profile.
OptoCplrLT has a low-profile interface, ~1mm device height and ~1.5mm with cap which, according to Optoscribe, allows compact interface layouts that alleviate packaging constraints and helps address footprint challenges.
Optoscribe’s solution is also compatible with industry-standard materials and processes; for example, the glass chip has a coefficient of thermal expansion matched to the silicon chip, helping to maximize performance.
Commenting Russell Childs, CEO of Optoscribe, said “We are pleased to announce that we are now sampling OptoCplrLT, which offers data centre operators, transceiver manufacturers and optical component suppliers an innovative solution to help address fibre-to-SiPh PIC coupling challenges and help overcome SiPh transceiver packaging and integration hurdles, while meeting market demands of performance, cost and volume.”