Murata Electronics has announced that its LTE-M solution, which is powered by Altair Semiconductor’s advanced cellular chipset, has secured Deutsche Telekom certification.

That certification means that the module can now be operated on the carrier’s German 4G LTE wireless network.

The device, measuring just 11.1 x 11.4 x 1.4mm, is claimed to be the world’s smallest form factor solution and has been designed to enable applications such as mobile IoT. In addition to its size, low power, and cost efficiency, the Type 1SC’s high level of integration can help to drastically reduce time to market and customers’ certification costs.

The module contains Altair’s advanced cellular IoT chipset; the ALT1250, which enables IoT devices to run for longer, providing years of operation without the need to replace batteries. Commercially available, the RoHS-compliant chipset features a hardware-based security framework and a rich set of features including integrated SIM (iSIM), an ARM Cortex M4 MCU for the user’s IoT applications and GNSS, suitable for enabling a wide-range of industrial and consumer IoT applications.

The Type 1SC is the first LTE-M module to be certified by Deutsche Telekom for use on its network. Developers can now leverage its confirmed interoperability with the mobile operator’s network to introduce new products and services.

“With the Deutsche Telekom certification, mutual customers can easily tap Murata’s RF expertise and access best-in-class solutions,” said Koichi Sorada, Product Manager Connectivity Modules, Murata Europe.

“Murata is a leading provider of innovative building blocks for the Internet of Things and through our strong partnership we continue to secure superior performance and quality needed for success in mobile IoT,” said Wayne Gilbert, Head of IoT Device Integration and Validation at Deutsche Telekom.