Micron starts shipping the industry’s first 176-Layer QLC NAND

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Micron Technology has begun volume shipments of the world's first 176-layer QLC NAND SSD.

Built with an advanced NAND architecture, Micron’s 176-layer QLC NAND delivers increased storage density and has been optimised for a broad range of data-rich applications.

Designed for use cases spanning client and data centre environments, the new NAND technology is available with the introduction of the Micron 2400 SSD, the first 176-layer PCIe Gen4 QLC SSD for client applications. The 176-layer QLC NAND will also be incorporated into select Micron Crucial consumer SSDs, and will be made available as a component for system designers.

The 176-layer QLC NAND provides a layer count and density described as unprecedented in QLC NAND flash and follows Micron’s delivery of the industry’s first 176-layer TLC NAND.

In addition, it enables 33% higher I/O speed and 24% lower read latency than Micron’s previous generations of solution. Its replacement-gate architecture is the only mass production QLC flash storage that combines charge trap with a CMOS-under-array design. These improvements are helping to drive adoption of QLC SSDs in the client PC market, which is expected to triple QLC adoption by 2023, exceeding 35%, and reaching nearly 80% bit share in 2025.

"Micron’s 2400 SSD builds upon our 176-layer NAND industry leadership to drive the transition to QLC-based storage for the client market,” said Jeremy Werner, corporate vice president and general manager of Micron’s Storage Business Unit. “Furthering our market leadership, we expect the new 2400 PCIe Gen4 SSD will significantly accelerate the adoption of QLC in client devices as it enables broader design options and more affordable capacity."