Leti, Fraunhofer to develop next gen technologies

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Two of Europe’s leading research institutes are to collaborate to develop next generation microelectronics technologies. Leti and Fraunhofer believe their partnership will spur innovation in their countries, while strengthening ‘European strategic and economic sovereignty’.

“The ability to develop key enabling technologies that overcome the formidable technical challenges that our leading technology companies will face, and transfer them quickly to industry is an essential focus for research institutes and industrials in France and Germany,” said Leti’s CEO Marie Semaria. “Building on previous successful collaborations, Leti and the Fraunhofer Group for Microelectronics will bring complementary strengths to the task of keeping France and Germany’s microelectronics industries in the forefront – and offer innovations across Europe.”

Leti and Fraunhofer Group for Microelectronics will focus initially on extending CMOS and More-than-Moore technologies to enable next-generation components for a range of applications, as well as systems to support French and German industries.

Fraunhofer Group for Microelectronics chairman Hubert Lakner added: “Micro/nanoelectronics and smart systems are key enabling technologies for the economic success of Europe, especially in France and Germany. Thus, Europe can no longer afford to scatter its research competences. For the benefit of industry, joining forces will become more and more important.”

Collaborative R&D projects will include: silicon-based technologies for next-generation CMOS processes and products; extended More than Moore technologies for sensing and communication applications; and advanced packaging technologies.