Infineon and pmd offer 3D-imager with increased range

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Infineon Technologies, together with pmdtechnologies, has developed a 3D depth sensor based on the Time of Flight (ToF)-technology to target applications in the consumer space.

The 3D sensor market in smartphones for rear side cameras is growing rapidly and is predicted to reach 500 million units per year through to 2024.

The REAL3 ToF sensor has been designed to enable differentiated camera performance in a wide variety of ranges, light conditions and use cases while saving battery’s life in mobile devices. For various applications, the new sensor provides techniques like real-time augmented reality, long range scanning, small object reconstruction, fast low power autofocus and picture segmentation. Effects such as background blur in videos and pictures from moving scenes are easily enabled without the need for post-photography processing and regardless of ambient light conditions.

“This 3D image sensor enables a new generation of applications”, says Philipp von Schierstaedt, Senior Vice President Infineon Technologies. “It aims to create more immersive and smarter AR experiences as well as better photographic results with a faster autofocus in low-light conditions or enhanced night mode portraits based on picture segmentation. This latest chip development is setting new standards when it comes to improvements of the imager, the driver and processing as well as unprecedented ten meters long range capabilities at lowest power.”

In addition, seamless augmented reality sensing experiences are possible, allowing for high quality 3D depth data capture up to a distance of ten meters, without losing resolution in the shorter range. Always-on applications such as mobile AR gaming can greatly benefit from the small power budget required by the new sensor, and provide users with longer playtime than ever.

For applications such as the 3D scanning for room and object reconstruction or 3D mapping for furniture planning and other design applications the sensor allows to double the measuring range beyond the current solution in the market.

The volume delivery for this chip starts in Q2 2021