If you can’t stand the heat …
The DTI’s Technology Programme is to support a new initiative to develop electronics packaging solutions for down well and aero engine applications that are capable of withstanding 250°C.
The UPTEMP project, which has received £192,000 from the Technology Programme, brings together Oxford University’s Materials Department with a consortium of end users, including Sondex Wireline, Vibro-Meter UK, Micro Circuit Engineering, Thermastrate and Gwent Electronic Materials.
The growing need to install electronic power and control systems in high temperature environments has posed a challenge to the traditional 125°C exposure limit for electronics systems.
With operating temperatures of more than 200°C typical in these applications, different semiconductors, passive components, circuit boards and assembly processes will be needed to fulfil the target performance specifications.
UPTEMP aims to demonstrate electronic packaging/assembly materials and processes for long term operation at temperatures up to 250°C on a representative circuit used in down hole and aero engine applications.
