“We believe in stretching the limits beyond conventional testing to ensure that our chips work reliably in extreme conditions,” said Bernd Lienhard, Vorago’s CEO. “Our customers appreciate that Vorago goes beyond industry expectations in testing VA10800 microcontrollers.”
The products under test are housed in an advanced plastic package composition developed for operation at 200˚C. The tests are intended to supplement traditional qualification tests by demonstrating the ability of the MCUs to operate at extreme temperature for prolonged periods.
High temperature operation is enabled by the use of Vorago’s HARDSIL technology, which uses standard manufacturing equipment. According to Vorago, this provides a cost effective alternative to the use of up screened commercial products, redundant systems or exotic packaging.
In addition to the high temperature plastic package, the MCU is available in ceramic package and die options.
