Faster and cheaper high-performance circuits

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Researchers of Valencia’s Polytechnic University (UPV) and the Spanish National Research Council (CSIC) have developed a new methodology that now makes it possible to manufacture high-performance circuits for telecommunications both faster and more cheaply.

Patented by both institutions, the process stands out due to the integration of 3D printing, which enables the use of different cast materials – metals and polymers. Furthermore, the researchers have also suggested a technique that makes it possible to metallise the printed materials and imbue them with conductivity.

“3D printing allows us to prototype very quickly; but 3D printing is usually done with plastic materials. As we needed the devices to be conductive in order to use them in microwave applications - circuits - they had to be metallised. And to do so, we have developed a technique that makes it possible to obtain a piece manufactured with a plastic material but with a very stable and lasting metallic coat that has very good conductivity,” explained Carmen Bachiller, professor at the higher technical school of Telecommunication Engineering and researcher for the iTEAM of the UPV.

Researchers of the Chemical Technology Institute (UPV-CSIC) have also taken part in the research, collaborating with the development and application of the metallisation of plastic materials.

The technique patented by the UPV and CSIC is of particular note due to the fast and cheap designing and manufacturing of microwave circuits used, for example, in devices placed aboard small satellites, vehicles and mobile communication base stations.