Execute in place memory updated for IoT edge applications

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As IoT and embedded devices become more intelligent, they need more program memory than can be implemented economically using embedded flash or SRAM. However, their memory requirements are less than the smallest DRAMs. According to Adesto Technologies, this gap can be filled by EcoXiP, an execute in place (XiP) non volatile memory technology.

EcoXiP is said to offer the advantages of traditional XiP systems, but to avoid the trade offs previously made with such approaches. Gideon Intranter, CTO, pictured, said: “Previous solutions were expensive, energy inefficient and had limited performance. EcoXiP has been designed specifically to be the main memory in smart IoT edge devices.”

The system, which features an octal SPI interface, is said to more than double host CPU performance, compared to quad SPI based solutions, while offering 1.4 times the performance of other octal based approaches.

The company also says SoC developers can design chips with less – or even no – embedded flash, allowing them to take advantage of leading edge process nodes.

Emmanuel Sambuis, vice president of NXP’s MCU and Connectivity business, said: “Our MCU and i.MX products will support this differentiated technology through an enhanced memory controller, enabling customers to take full advantage of these memories.”

Adesto is initially offering a 32Mbyte solution, but plans to offer variants with up to 128Mbyte.