Collaboration advances flexible OLED technology

GE has demonstrated an ultra high barrier (UHB) thin film encapsulation process on a wide variety of OLED structures through a batchmode, plasma enhanced chemical vapour deposition process. This method provides high performance hermetic packaging and enables lightweight, flexible flat panel devices to be manufactured by a low cost, high throughput process such as roll to roll manufacturing. “Encapsulating OLEDs presented a significantly different challenge from our previous success in producing barrier coated plastic substrates,” commented Dr Ahmet Gün Erlat, materials scientist at GE Global Research. “The USDC funded program provided GE with the opportunity to further develop key technologies and applications that can dramatically impact the flexible electronics infrastructure.”