This integration is intended to offer customers seamless collaboration between electronic and mechanical engineering to accelerate the development of smart products through efficient co-design.
At a time when electrical and mechanical engineers are facing increased pressure to produce products with fewer revisions, efficient collaboration is key to delivering smart products to market on time. Current manual design data methods require users to exchange files that can differ from design intent, resulting in errors, unnecessary re-work and costly delays.
To address these challenges, the companies have integrated Autodesk Fusion with Cadence’s Allegro X and OrCAD X platforms to provide a solution that enables seamless bi-directional communication between PCB designers and mechanical engineers.
The integration enables companies to take full advantage of cloud-based mechanical design and generative AI/ML PCB design, while leveraging multi-physics analysis for power, thermal, electromagnetics etc.
“The electronics industry is being disrupted on multiple fronts including supply chain challenges and rapidly accelerating product complexity,” said Tom Beckley, senior vice president, Cadence. “Our partnership with Autodesk provides access to leading-edge technology for electronic design integrated with Autodesk’s leading cloud-enabled, connected mechanical CAD solutions.”
“Our partnership with Cadence powers a seamless collaboration between mechanical and electronics design, putting customers at the centre,” added Jeff Kinder, executive vice president, Autodesk. “Manufacturers need to bring more complex products to the market faster – all while juggling distributed teams, supply chain disruptions, and costs. This integration further extends Autodesk’s vision to connect end-to-end design and make processes in manufacturing.”