The concept could allow electronics devices to release heat more readily while working at a cooler temperature, says the team. “One of the key limitations for electronic devices is the heat they generate – and something that helps dissipate that heat will help them operate at faster speeds and prevent failure,” said Professor Chih-hung Chang. “The more bubbles you can generate, the more cooling you can achieve.”
The new approach uses piezoelectric inkjet printing to create hydrophobic polymer ‘dots’ on a substrate, on which a hydrophilic zinc oxide nanostructure is deposited. By controlling the material’s hydrophobic and hydrophilic structure, bubble formation can be manipulated for the desired goal.
According to the researchers, the technology may have application in solar energy, advanced lasers, radars and power electronics, where high heat levels need to be dissipated.
