ADLINK launches MXM graphics modules based on NVIDIA Ampere architecture

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ADLINK Technology has introduced the industry’s first embedded MXM graphics modules based on the NVIDIA Ampere architecture.

Built for accelerated computing and AI workloads at the edge, these embedded graphics modules deliver real-time ray tracing, AI-accelerated graphics and energy-efficient AI inference acceleration in the compact mobile PCI express (MXM) form factor. These modules have been designed to enhance responsiveness, precision and reliability for mission-critical, time-sensitive applications in healthcare, manufacturing, transportation, gaming and other sectors.

With computing and AI workloads shifting from the cloud to the edge to shorten response time, enhance security and lower communication costs and with more data being processed at the edge, performance requirements are getting higher while the power budget remains nearly unchanged.

"The NVIDIA Ampere architecture is able to deliver a major boost in performance and power efficiency, and enables general computation, image processing and reconstruction, and AI inference at the edge to advance to the next level,” said Zane Tsai, director of platform product center, ADLINK.

“The NVIDIA Ampere architecture delivers breakthrough performance and features, combining the latest generation RT Cores, Tensor Cores, CUDA Cores, PCIe Gen 4 and NVIDIA video codecs,” explained Scott Fitzpatrick, VP of product marketing at NVIDIA. “As rendering and simulation become ubiquitous across industries, NVIDIA’s latest embedded solutions offer up to 2x rendering performance, 2x FP32 throughput, as well as hardware-accelerated video encoding and decoding for significant increases in both graphics and compute workloads.”

Based on the NVIDIA Ampere architecture, ADLINK’s embedded MXM GPU modules offer up to 5,120 CUDA Cores, 160 Tensor Cores and 40 RT Cores with support for PCIe Gen 4 and up to 16GB GDDR6 memory at up to 115 watts of TGP.

These modules are intended for compute-intensive, graphics-demanding, memory-hungry applications.

They are one-fifth the size of full-height, full-length PCI Express graphics cards, and are hardened to operate under severe temperature extremes, shock and vibration, and corrosion resistance for use in size, weight and power-constrained edge environments.

These embedded graphics modules offer longevity support for five years.