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Soldertec Global
25 Oct 2007

More in

Manufacturing
Consumer
Board Level Design

Step by Step Failure Analysis

Events

This workshop designed to help identify the common reasons for board failures.
St Albans.

This workshop brings together the practical and sophisticated methods of determining the root cause of failures on printed boards, components, materials and solder joints and identifying the common reasons why failures occur.
board failure analysis
www.ASKbobwillis.com/LGAworkshops.pdf

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