Engineering publications brought to you by Mark Allen

New Electronics

WRC-19 identify mmWave spectrum for 5G services

SET Introduces new automatic flip-chip bonder

Magnetic gear tooth sensor IC designed for traction motors

Transtector expands NEMA-rated weatherproof enclosure line

Supermicro collaborates with Intel on large scale distributed training AI systems

First global mass production of smart eCockpits

Toshiba launches compact resettable eFuse IC

Flex Power Modules DC-DC converters target railway rolling stock

Wind River introduces Kubernetes-based cloud platform

European semiconductor distribution declines through summer

Infinera announces new TSN optical switch for 5G and fibre deep applications

Renesas Electronics introduces ASi-5 ASSP for industrial automation