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Samsung acquisition marks first major push into healthcare

‘World’s first’ 2d to 3d video conversion chip for handheld devices

ARM extends software interface standard

Imperas launches Cortex-M3 core model for virtual platform based software development

Timesys announce collaboration with Freescale Semiconductor

P-channel mosfet improves reliability says Diodes

Avnet Memec signs pan European deal with Renesas

Thin film packaged mems resonator has ‘industry record’ Q factor

£2million funding aims to stimulate space innovation

Nanosys joins non volatile memory development programme

Renesas implements Imagination’s gpu technology in mobile SoC