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Satellite navigation poses challenges for automotive electronics engineers

Recast of RoHS directive has implications for design engineers

Embedded World 2013: Microchip unveils BodyCom technology

Embedded World 2013: MISRA standard updated for more clarity

MWC: ARM's big.LITTLE concept attracts five new customers

Qualcomm’s Snapdragon 800 processor to use TSMC’s 28HPM process

Module said to speed M2M development

Nexeon looks to commercialise silicon anode technology

4G auction raises less than expected

Beamforming sustains high data rates over short distances

Infineon qualifies thinned wafer power semiconductor process

Display platform upgrades the user interface and product functionality