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Consumer

Dave Bell, president, Intersil

‘World’s first’ 2d to 3d video conversion chip for handheld devices

ARM extends software interface standard

Imperas launches Cortex-M3 core model for virtual platform based software development

Timesys announce collaboration with Freescale Semiconductor

P-channel mosfet improves reliability says Diodes

Avnet Memec signs pan European deal with Renesas

Thin film packaged mems resonator has ‘industry record’ Q factor

Nanosys joins non volatile memory development programme

Renesas implements Imagination’s gpu technology in mobile SoC

Renesas launches secure processor in 0.22mm high package

Xilinx launches three dsp development platforms