Engineering publications brought to you by Mark Allen

Consumer

Samsung, Intel collaborate on next generation mobile network architecture

Basestation processor family blends dsp and Power Architecture cores

Mobile world congress 2011

ST announces ‘world’s smallest’ pico projector for smart phones

Growth in the widening consumer electronics sectors fuels increasing demand for passive components

CSR collaborating with TSMC on 90nm embedded Flash process

Protection for high bandwidth connections on a single chip

Can digital fingerprint put an end to counterfeit components?

Device reduces charging time by half

Rick Clemmer executive director, president and chief executive officer, NXP

Intel resuming shipments of 6 Series chipset

‘World’s first’ Freescale i.3 processor DIMM module