Engineering publications brought to you by Mark Allen

CPUs

MagnaChip and Melfas announce OLED collaboration

Conrad distributes a new development environment

Bridgetek joins forces with Zerynth & Riverdi to forge IoT Technology Partnership

Hyperstone’s FlashXE provides maximum reliability of 3D NAND

Tomorrow’s in-vehicle infotainment

Space applications scaled with Arm Core MCUs

Infineon’s CIPOS Micro IPM adds IGBT based IM231 series

Hall-effect switch and latch ICs enhance ADAS safety

Qualcomm DDFA amplifier solution brings clearer sound to speakers

Compact 4-channel automotive power management IC for vehicle camera modules

Cog Systems’ Secure Virtualization now available in Snapdragon platforms

Expanded dual- and single-core dsPIC DSC family from Microchip