Engineering publications brought to you by Mark Allen

Memory

NEO Semiconductor announces the development of its 3D X-AI chip

M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions

Marvell presents Structera CXL product line targeting cloud data centres

Weebit Nano and DB HiTek tape-out ReRAM module

Avalanche Technology introduces enhanced MRAM for space and defence

RAAAM awarded €5.5m by EIC to develop SRAM alternative

DigiKey signs global partnership agreement with Kingston Technology

Micron introduces the world’s fastest data centre SSD

JEDEC unveils new plans for DDR5 MRDIMM and LPDDR6 CAMM standards

Quinas and IQE receive £1.1 million grant for ULTRARAM industrialisation

Samsung completes validation of industry’s fastest LPDDR5X

Teledyne e2v 8 GB DDR4 memory chip targets high reliability space applications