Engineering publications brought to you by Mark Allen

Interconnection

CEA-Leti introduces plastic mmWave system

Third-generation 112G-LR SerDes IP

GUC announces GLink-3D Die-on-Die interface IP

STMicroelectronics looks to deliver protection for high-speed interfaces

Cadence unveils low-power IP for PCI Express 5.0 specification on TSMC N5 process

NeoPhotonics makes Class 60 versions of CDM and Micro-ICR available

Diodes adds to its range of linear ReDriver ICs

Diodes expands video passive multiplexer/demultiplexer switch portfolio

AMI qualifies Renesas' I3C bus extension products

MIKROE launches its 1000th Click board

Nexperia announces ESD protection devices for automotive applications

eSync and GENIVI collaborate on data standardisation