Engineering publications brought to you by Mark Allen

Manufacturing

Kinetis MCU is ‘smaller than a golf ball dimple’

Embedded World 2014

Bendable, stretchable optical interconnect developed

Spansion introduces high data rate memory interface

Electronics Leaders Group signs up to Kroes’ action plan

Seminar tackles counterfeit components in the supply chain

Partners demonstrate ‘trail blazing’ DSP based on FD-SOI process

News analysis: Acquisition strengthens Microsemi’s position in the supply chain

Industrial electronics market rebounds

Converter boasts accuracy and small footprint

Solar cell manufacturing process could have wider application

Point of load converter range expanded