Engineering publications brought to you by Mark Allen

Semiconductors

Infineon collaborates with Qualcomm to enable 3D authentication

AI chipmaker Hailo raises $60m

FTDI launches latest series of multi-channel USB interface ICs

Silicon Labs announces SoC IoT security

New DSP architecture unveiled by CEVA

TASKING expands strategic Infineon partnership

Marvell launches OCTEON fusion wireless infrastructure processors

Xilinx launches Alveo U25 SmartNIC platform

NXP to leverage Fraunhofer’s MPEG audio SDK

MathWorks automates vision systems design on FPGAs and ASIC

Menta and Secure-IC look to optimise embedded cybersecurity

Globalfoundries delivers production-ready eMRAM on 22FDX platform