Engineering publications brought to you by Mark Allen

Research Design

Solution for next generation nanochips comes out of thin air

CEA-Leti develops circuits for neuromorphic processors

Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration

CEA-Leti extends 300mm wafer line

Battery-powered devices to benefit from a sense of hearing

GLOBALFOUNDRIES announces first 300mm SiGe foundry technology

University of Liverpool and IBM sign joint study agreement

Replicate physical objects for VR/AR

Study unlocks full potential of 'supermaterial' graphene

Flexible electronic skin aids human-machine interactions

Infineon and IDEX Biometrics join forces

Scientists look to bring high-performance computers to the masses