Engineering publications brought to you by Mark Allen

Policy & Business

Fault tolerant designs allow defective chips to be used instead of scrapped

Chipmakers move to 3d to create successor to multichip module

Government calls for future R&D funding to focus on new technologies

IEEE launches new Ethernet bandwidth group, looks beyond 100Gbit

Repeaters triple reach of PCI Express Gen-3 Standard

Designing for extreme temperatures

AMD to support USB 3.0

R&D competitions launched to accelerate UK innovation

Remote Sensing Workshop - Meeting Industry Needs with NERC Expertise

Software Safety – Where’s the Evidence?

Next gen WiMax standard approved by IEEE

Improving Brand, Product and Packaging Security to Combat IP Theft in the Electronics Supply Chain seminar and exhibition