Engineering publications brought to you by Mark Allen

Consumer

Integrated solution for thermal characterisation and analysis

World's smallest 3-axis digital gyroscope?

VENTURI project aims to make mobile augmented reality fully immersive

Xilinx makes first shipments of Zynq

MCU and transceiver combo targeted at ‘most vexing’ power apps

IAR, Express Logic extend relationship as ThreadX integrated into Embedded Workbench

Will software platform be 'iTunes for IP'?

Programmable solution bridges between incompatible devices

Intel leaders forecast trends for 2012

IBM set to make Micron’s memory cube

Will eda acquisition benefit chip designers or investors?

$9million funding enables advances in 3d multimedia for smartphones