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Electronics

ByteSnap launches SnapPro IQ accelerating PCBA test solutions and securing IP

xMEMS Labs looks to secure ‘foothold’ in booming AI glasses market

CSignum secures £6m to transform underwater wireless networks

Samsung set to end DDR4 production in the face of Chinese competition

Wayve opens Testing and Development Centre in Japan

VeriSilicon launches ultra-low power OpenGL ES GPU for wearables

Renesas debuts new additions to its RA0 microcontroller portfolio

Back flip FPC connector features staggered contact array for narrow-pitch

TSMC remains bullish despite tariff headwinds

Cadence to acquire Arm Artisan Foundation IP business

Navitas’ SiCPAK power modules deliver reliability at high temperatures

SemiQ 1200 V SiC MOSFET modules enable more compact, cost-optimised systems