Engineering publications brought to you by Mark Allen

Internet of Things

Winbond unveils 1Gb QspiNAND Flash for wearable and low-power IoT devices

ROHM unveils industry’s smallest CMOS Op Amp for smartphones and IoT devices

POLYN introduces Evaluation Kit for NeuroVoice

New Edge AI evaluation kit accelerates ML application development

MIKROE simplifies integration of Arduino Portenta with over 1600 Click boards

The transformational impact of AI

Panasonic Industry offers multi-tier Matter Certificate Service

Embedded security specialist Exein raises €15m in Series B funding

ST integrates Ceva Cellular IoT Platform in its NB-IoT industrial module

Farnell now stocking Murata's UWB and LoRa modules

Mouser stocking Espressif Systems’ open-source AIoT kit

Identity parade