Engineering publications brought to you by Mark Allen

Board Level Design

Cadence's unveils DesignTrue DFM Ecosystem

Smallest logic package without a step-down mask

Zuken and Polar Instruments announce collaboration

Arduino Yún prototyping board for IoT projects and applications

The Zephyr Project grows IoT ecosystem

Thermal management of electronic devices with COMSOL in 18 minutes

Canting kit for OKW’s extruded enclosures

Global semiconductor sales rise by 20.4%

Leti and CMP provide multi-project wafer service with integrated silicon oxram

Cadence selected for DARPA ERI machine learning contract

“World’s most efficient” semiconductor for thermal management

Future electronic components to be printed like newspapers