Engineering publications brought to you by Mark Allen

Neil Tyler

CPUs

Samsung narrows Intel’s global chip market lead in Q2

Displays

Chirp and Arduino partner

Automotive

Harwin introduces ready-made cable assemblies for its Datamate connectors

Embedded Systems

VCS-1 embedded processor module for precision robotics

Power

Diodes looks to buy Lite-On Semi

Distribution

Conrad Electronic simplifies procurement of products and services

Communications Hardware

Marvell extends NVMe-oF Ethernet SS technology leadership

Manufacturing

High-density 3D stack test chip

Displays

Semtech and Murata sampling new LoRa-based modem platform

Communications Hardware

Winbond memory chip now supports NXP Layerscape LS1012A

First blueprint for human robot interaction launched

Automotive

Sensorless control pre-driver IC for BLDC motors